Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith
US5739187A · kind A · utility
13Cited by
10References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 14, 1996 |
| Grant date | Apr 14, 1998 |
| Priority date | — |
| Expiry date | Mar 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.