Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone
US5739217A · kind A · utility
8Cited by
2References
24Claims
0Family size
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Key dates
| Filing date | Sep 29, 1995 |
| Grant date | Apr 14, 1998 |
| Priority date | — |
| Expiry date | Sep 29, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is a reliable epoxy resin molding material for sealing electronic parts which is excellent in, for example, thermal shock resistance and reflow soldering resistance, and is free from the troublesome deterioration in, for example, the appearance and marking properties of molded products, and to provide a semiconductor sealed by the molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.