Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
US5740013A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1996 |
| Grant date | Apr 14, 1998 |
| Priority date | — |
| Expiry date | Jul 3, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure for integrated circuit devices is disclosed. The enclosure includes a first portion which substantially encloses a plurality of secondary, relatively low-power integrated circuit devices and which includes a mechanism for contacting the secondary integrated circuit devices in order to conduct heat away. The enclosure also includes a second portion, which may include an active cooling device, directly in contact with a primary, relatively high-power primary integrated circuit device. In addition to removing heat, the first and second enclosure portions together shield the integrated circuit devices to contain electromagnetic energy generated by the devices. The first and second enclosure portions also allow different levels of force to be applied to the primary and secondary devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.