Method for manufacturing semiconductor device
US5740065A · kind A · utility
19Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 1995 |
| Grant date | Apr 14, 1998 |
| Priority date | — |
| Expiry date | May 24, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7046
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for manufacturing a semiconductor device comprises the steps of extracting an optimal working condition by accumulatively averaging accumulated working conditions of lots previously performed in an expectation process to be currently performed in the manufacturing equipment, extracting a correction condition by extracting information for an alignment state of a lower layer performed by the expectation process, and setting the working condition by adding the correction condition to the optimal working condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.