Low profile thermally set wrapped cover for a percutaneously deployed stent
US5741326A · kind A · utility
64Cited by
9References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1996 |
| Grant date | Apr 21, 1998 |
| Priority date | — |
| Expiry date | Jul 15, 2016 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2002/9583
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An endoprosthesis assembly for percutaneous deployment on a balloon catheter is disclosed. The assembly includes a radially expandable stent overlied by a tubular, low profile stent cover wrapped over the stent. The wrapped cover is thermally set to maintain its low profile wrapped configuration during deployment of the assembly. At the treatment site, the balloon portion of the catheter is inflated causing the stent to expand radially and the stent cover to unwrap and open to conform to the expanded configuration of the stent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.