Spotter-deposit method and apparatus
US5741405A · kind A · utility
7Cited by
10References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1996 |
| Grant date | Apr 21, 1998 |
| Priority date | — |
| Expiry date | Jul 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for sputter-depositing a layer of a material on a substrate, in which the layer is applied to the substrate by sequentially effecting a plurality of partial sputter-deposits thereon during a plurality of operational periods each including a sputter-deposit time interval followed by a non-deposit time interval of at least equal duration to the sputter-deposit time interval.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.