Conductive adhesive bonding means
US5741430A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1996 |
| Grant date | Apr 21, 1998 |
| Priority date | — |
| Expiry date | Apr 25, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of electrically and mechanically bonding conductive surfaces with conductive adhesives, wherein at least one of the conductive surfaces is of the type upon which unstable oxides readily form. The conductive adhesives having a predetermined amount of conductive particles. The conductive particles having a rigidity at least as hard as the materials composing the conductive surfaces and any oxide formed thereon. The bonding method including the step of preparing the conductive surfaces so that a microscopically roughened oxide surface is formed thereon. The method further including the step of simultaneously applying a predetermined amount of heat and pressure to cure the conductive surface-conductive adhesive-conductive surface joint such that the conductive particles in the conductive adhesive pierce through the oxide to make direct contact with the conductive surfaces thereunder. The method controls the mechanical strength of the bond and the electrical characteristics of the bond joint. The electrical characteristics include joint resistivity and joint sensitivity to elevated temperature and/or humidity conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.