Method for depositing metal fine lines on a substrate
US5741557A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 1995 |
| Grant date | Apr 21, 1998 |
| Priority date | — |
| Expiry date | May 24, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/857
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for forming a desired pattern of a material of conductive or non-conductive type on a variety of substrates. It is based on the use of a pen which essentially consists of a refractory tip wetted with the material in the molten state. The pen preferably consists of a pointed tungsten tip attached to the top of a V-shaped tungsten heater, forming a heater assembly. The tip and the heater top portion are roughened at the vicinity of the welding point. In turn, the ends of the V-shaped heater are welded to the pins of a 3-lead TO-5 package base. The pen is incorporated in an apparatus adapted to the direct writing technique. To that end, the pen is attached to a supporting device capable of movements in the X, Y and Z directions, while the substrate is placed on an X-Y stage for adequate X, Y and Z relative movements therebetween. The two pins of the pen are connected to a power supply to resistively heat the heater. When the welding point of the tip/heater assembly reaches the melting point of the material to be deposited, it is dipped in a crucible containing the material in the molten state. The welding point nucleates a minute drop of the liquid material, thus forming a re…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.