Laser peening process and apparatus
US5741559A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 23, 1995 |
| Grant date | Apr 21, 1998 |
| Priority date | — |
| Expiry date | Oct 23, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D7/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method and apparatus for improving properties of a solid material by providing shock waves therethrough. Laser shock processing is used to provide the shock waves. The method includes applying a water based coating to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shock wave. A high speed jet of fluid is directed to coated portion of the solid material at times to remove the coating from the solid material. Additionally, the method may include directing a high speed jet of fluid to the surface of the solid material to dry the solid material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.