Thermoplastic moulding compounds, a process for their preparation and a process for the production of ceramic or metal moulded parts by sintering
US5741842A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1996 |
| Grant date | Apr 21, 1998 |
| Priority date | — |
| Expiry date | Feb 16, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic moulding composition containing at least one sinterable ceramic or metal powder and a mixture of thermoplastic binders, wherein one of the binders is a silicone resin and the second binder is an organic resin. The silicone resin has the a softening point of 40.degree. to 150.degree. C. and an average formula of: EQU R.sub.a.sup.1 Si (OH).sub.b (OR.sup.2).sub.c O.sub.(4-a-b-c)/2 wherein PA1 a is in the range of 0.95 to 1.2 PA1 c is in the range of 0 to 0.2 PA1 the sum of a+b+c is 1.05 to 1.5 PA1 the sum b+c is at most 0.3 PA1 R.sup.1 denotes methyl and PA1 R.sup.2 denotes one or more of C.sub.1 -C.sub.18 alkyl radicals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.