Direct adhering polysilicon based strain gage
US5742222A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1995 |
| Grant date | Apr 21, 1998 |
| Priority date | — |
| Expiry date | May 26, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/2293
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An economical non-metallic strain gage insensitive to ambient temperature variations, and without a diode junction, which is suitable for general use and particularly for use in touch screens, wherein the gage is adapted to be directly adhered to the screen. The gage is metallized with a thin layer of a solderable metal for electrical soldering connection to strain measurement devices and for reliable mechanical support. The gage includes an etched polysilicon material on a substrate base, such as a silicon wafer, wherein the polysilicon is doped with a dopant material such that output measurements are independent of temperature changes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.