Flexible thermally conductive stamp and material
US5743185A · kind A · utility
11Cited by
23References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 1997 |
| Grant date | Apr 28, 1998 |
| Priority date | — |
| Expiry date | May 12, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/282
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A flexible thermally conductive stamp and material is fabricated of a support handle and a heat conductive member. The heat conductive member supports raised image portions which together with the heat conductive member are formed of a flexible resilient thermally conductive material. The thermally conductive material is preferably fabricated of a mixture of Plastisol and aluminum powder. Portions of the raised image area of the stamp include angled side surfaces which improve the thermal conductivity of the stamp.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.