Low loss, thick film metallizations for multilayer microwave packaging
US5744232A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 1996 |
| Grant date | Apr 28, 1998 |
| Priority date | — |
| Expiry date | Jul 11, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/257
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thick film metallization compatible with low temperature cofired ceramics (LTCC) that displays very low microwave insertion losses commensurate with those of thin film gold. However, the disclosed metallization is applied similar to conventional metallizations by screen printing and has no limit to the number of layers achievable. The electrical performance of the metallization is attained by using a spherical metal particle shape and uniform particle size distribution in the thick film paste. The advantage of this invention is that superior microwave performance can be achieved in electronic packages without the cost and limitations imposed by thin film metallization techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.