Semiconductor device composed of plural semiconductor chips and coupling means which couple the semiconductor chips together
US5744379A · kind A · utility
12Cited by
18References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1995 |
| Grant date | Apr 28, 1998 |
| Priority date | — |
| Expiry date | Jun 6, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image sensor chips 1 with each other, and the couple one semiconductor image sensor chip 1 to a driver substrate 3 which mounts thereon a semiconductor driving chip 2 for driving the semiconductor image sensor chips 1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.