Multilayer circuit board and process of production thereof
US5744758A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1996 |
| Grant date | Apr 28, 1998 |
| Priority date | — |
| Expiry date | Aug 9, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board includes a plurality of substrates. Each of the substrates includes a thermosetting resin film having respective surfaces, a metal layer formed on the one of the surfaces and a thermoplastic polyimide film formed on the other surface. Each of the substrates has at least one via hole, which is filled with thermoplastic polyimide resin containing electrically conductive material to form an electrically conductive via. The metal layer is defined as a predetermined circuit pattern electrically connected to the via. The plurality of substrates are laminated in such a manner that the substrate is adhered to an adjacent one by means of the thermoplastic polyimide film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.