Reduced thickness semiconductor device with IC packages mounted in openings on substrate
US5744862A · kind A · utility
79Cited by
8References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 20, 1996 |
| Grant date | Apr 28, 1998 |
| Priority date | — |
| Expiry date | Nov 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device of the present invention enables mounting with a reduced thickness and a high density. IC packages (17) are mounted in each opening (12) on both surfaces of a substrate (11) in such a way that package bodies (18) are half accommodated in the opening (12) formed in the substrate (11).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.