Encapsulated electronic component having a plurality of connection leads of martensitic structural-hardening conductive alloy
US5744868A · kind A · utility
4Cited by
4References
8Claims
0Family size
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Key dates
| Filing date | Apr 25, 1996 |
| Grant date | Apr 28, 1998 |
| Priority date | — |
| Expiry date | Apr 25, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An encapsulated electronic component containing a plurality of connection leads and an outer case, where the connection leads extend externally to the outer case and contain martensitic structural-hardening conductive alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.