Thermal printing head
US5745149A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1996 |
| Grant date | Apr 28, 1998 |
| Priority date | — |
| Expiry date | Oct 4, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3452
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal printing head of a printing apparatus is provided. The thermal printing head includes an alumina substrate on which a plurality of heat resistors and signal supplying aluminum pattern elements are formed, a print circuit board for supplying an electric signal and power to the heat resistors, which is located adjacent to the alumina substrate, a heat sink for discharging heat, wherein the heat sink is attached to the bottom of the print circuit board and the alumina substrate; and a driving IC mounted on the alumina substrate, each signal supplying aluminum pattern element thereof being formed of two portions having different widths which are alternately connected in a lengthwise direction along the signal supplying aluminum pattern. This arrangement minimizes or prevents contamination of the wire bonding pad due to bleeding of solder resist and non-conductive epoxy along the signal supplying aluminum pattern element during manufacturing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.