Laser diode structure with integrated heat sink
US5745514A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1996 |
| Grant date | Apr 28, 1998 |
| Priority date | — |
| Expiry date | Apr 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02423
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser diode structure includes a metallic gasket which is sandwiched between the laser diode submount and the backside electrode in the absence of solder interfaces. The gasket has mirror image, shallow recesses in the surfaces thereof with each surface having the general shape of a wing. The recesses are formed into sealed coolant conduits when the several layers are bonded together into an integrated structure. The narrow end of each recess communicates with an aperture through the adjacent layer to provide inlet and outlet ports for the coolant. The gasket has an aperture therethrough at the wide ends of the recesses for the coolant to circulate. The gasket can be formed from a single layer or from two layers each with a single recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.