Method for making an electronic module
US5745984A · kind A · utility
390Cited by
8References
8Claims
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Key dates
| Filing date | Jul 10, 1995 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Jul 10, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.