Method of attaching a semiconductor microchip to a circuit board
US5745985A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1995 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Oct 20, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of attaching a microchip onto a circuit board is described. The method may include: forming a core portion of thermally conductive and electrically conductive material 50; forming a perimeter portion of thermally conductive and electrically nonconductive material 54; placing the core portion of thermally conductive and electrically conductive material 50 at a site on a circuit board 58 where the microchip 56 will be bonded; placing the perimeter portion of thermally conductive and electrically non-conductive material 54 around the core portion 50 on the circuit board; and attaching microchip component 56 to the core portion 50 and the perimeter portion 54. The method may also include applying a catalyst on the circuit board before attaching the core and perimeter portions. The method may also include curing the core portion and the perimeter portion at 90 degrees C. for 10 minutes and then applying a catalyst on the core portion and the perimeter portion. The materials may once again be cured at 90 degrees C. for 10 minutes. Other devices, systems and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.