Method and apparatus to wick solder from conductive surfaces
US5746367A · kind A · utility
11Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1996 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Apr 8, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for removing solder from an area grid array pad by applying a wire mesh to a conductive surface of the area grid array that is covered with solder. Heat is applied to the wire mesh and the conductive surface of the area grid array so that the solder flows from the conductive surface onto the wire mesh. The wire mesh is removed from the conductive surface thereby removing all solder from the conductive surface of the area grid array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.