Electrical connecting device and method for making same
US5746927A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1996 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Dec 12, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and the terminals are electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.