Direct chip attachment (DCA) with electrically conductive adhesives
US5747101A · kind A · utility
37Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1996 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Apr 9, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.