Method of applying a film to a substrate
US5747117A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 4, 1997 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Jun 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/01
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A film is applied to a substrate in accordance with a predetermined pattern by applying a solution of a copolymer of fluoropolymers dissolved in a solvent onto the surface of the substrate; curing and annealing the solution to boil off the solvent and form a copolymer film on the substrate; depositing a thin metal film on the copolymer film; patterning the thin metal film by a photoresist etching process to expose the underlying copolymer film in accordance with the predetermined pattern; removing the exposed copolymer film so that the underlying substrate is exposed in accordance with the predetermined pattern; removing any remaining thin metal film; depositing the film to the remaining copolymer film and exposed substrate; then removing the remaining copolymer film and any film applied thereon by ultrasonic cleaning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.