Deposition of silver layer on nonconducting substrate
US5747178A · kind A · utility
24Cited by
84References
35Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 6, 1995 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Mar 6, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31707
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A thin silver layer is deposited on the surface of a nonconducting substrate using an electroless process. The surface is cleaned and activated in aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt in the absence of an electric current, but in the presence of a deposition control agent. Optionally, the silver layer is stabilized with an aqueous solution of a platinum-group metal and/or gold. The resulting silver layer is uniform and of 2-2000 .ANG. thickness; it strongly adheres to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.