Method of manufacturing an integrated electro-optical package
US5747363A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 1997 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Jul 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate and include vertical interconnections to driver and control circuits mounted on an uppermost surface of a printed circuit board (PCB). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy. A hermetic seal is formed by positioning a sealing ring formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.