High heat resistant hot melt adhesive
US5747573A · kind A · utility
49Cited by
10References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 16, 1995 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Nov 16, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A high heat resistant hot melt adhesive composition, its method of manufacture and its use on plastic and metallized foil containers, structures and the like is described herein, which adhesive contains a blend of an amorphous polyalphaolefin polymer, a solid benzoate plasticizer and a hydrocarbon tackifier where the elevated peel value of the resulting adhesive composition is greater than 160.degree. F.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.