Helical surface-mounted test point
US5747740A · kind A · utility
Inventor
Key dates
| Filing date | Apr 23, 1996 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Apr 23, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A continuous wire loop test point to be soldered to a substrate includes five portions of a single length of wire bent to form more than a single turn of a generally helical loop. The central portion of the length of wire lies in a first plane and constitutes a bridging section. The two portions of the wire at the opposite ends of the bridging section are bent away from the first plane and are referred to as support sections because they support the bridging section after the loop is completed and is mounted on a substrate. The two end portions of the wire that extend from the ends of the support sections are bent inwardly to form a base section beneath the bridging section, These end portions extend generally toward each other diverge but at enough of an angle so that their tips do not meet but extend past each other. As a result, the maximum width of the base section, measured from the outer edge of one of the end portions to the outer edge of the other end portion is greater than the width of the bridging section, measured perpendicularly to wire forming that section. This provides a structure that is more stable standing on the base section than on any other section when placed…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.