Method of laser forming a slot
US5747769A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1995 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Nov 13, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/389
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for forming a slot in a metal component having first and second opposite surfaces utilizes a first laser beam having a pulse rate and power to vaporize the metal. The laser beam is traversed across the first surface at a feed rate so that each beam pulse vaporizes the component metal at a spot. The laser beam pulse rate and feed rate are effective so that successive spots do not substantially overlap each other. The laser beam is traversed in repeated steps in a series of passes so that the spots collectively form a continuous slot to a depth below the first surface. In a subsequent step, a second laser beam is positioned in the slot to drill a hole through a base of the slot, with the second laser beam being repositioned to drill a plurality of the through holes spaced apart from each other along the length of the slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.