Multi-chip module inductor structure
US5747870A · kind A · utility
80Cited by
9References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 8, 1995 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Jun 8, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00013
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a multichip module structure comprising a silicon, alumina or sapphire substrate carrying a plurality of layers of metallisation separated by polymer dielectric layers, with one or more inductors formed in the uppermost metallisation layer, a ferrite core for one of those inductors is located over the inductor and secured in position by flip chip solder bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.