Heat sink and circuit enclosure for high power electronic circuits
US5748445A · kind A · utility
17Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1996 |
| Grant date | May 5, 1998 |
| Priority date | — |
| Expiry date | Aug 27, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20418
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention describes a triangular heat sink and circuit enclosure for high power dissipation electronic circuits. The heat sink uses a number of cooling fins to provide cooling of the circuitry and equipment contained in the circuit enclosure and can handle power dissipation levels of up to 15 kilowatts. The circuit enclosure uses air moving devices and triangular heat sinks to provide both conduction cooling and heat transfer to a stream of air. The cooling fins of the heat sink are sealed away from the electronic components when the circuit enclosure is assembled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.