One-component primer/bonding-resin system
US5749733A · kind A · utility
12Cited by
18References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1997 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Apr 25, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S522/908
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Primer/bonding-resin compositions include certain hydrophilic monomers, reactive diluent monomers, high viscosity adhesive resins and photo-initiator systems, all provided in a one-component solution containing ethanol or acetone or other suitable solvents. Methods of use of such compositions include a single step application for priming and imparting enhanced adhesion between dental substrates and dental restoratives or components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.