Bonding strap for non-metallic electrical enclosure
US5749740A · kind A · utility
12Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1996 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Sep 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/62
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A bonding strap for non-metallic electrical enclosures, which is directed to the provision of a metallic bonding strap for non-metallic, back-to-back electrical enclosures. The bonding strap facilitates automatic bonding between the bridge of bridge-mounted electrical devices which are installed in the enclosure and a grounding conductor terminated to the strap so as to provide two locations for attaching grounding conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.