Semiconductor member, and process for preparing same and semiconductor device formed by use of same
US5750000A · kind A · utility
69Cited by
8References
69Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1996 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Nov 25, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/96
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a substrate with an insulating surface and a non-porous semiconductor region bonded to the body of the device. A porous semiconductor region on the surface of the substrate was removed by etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.