Image-forming process
US5750291A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1996 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Jun 13, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0793
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for the formation of a patterned resist of a photocurable material on a circuit board, the uncured portion of which is water soluble. The process includes the steps of forming a layer of an aqueous emulsion of a photocurable material upon the circuit board, drying the layer to a substantially dry and non-tacky state, imagewise exposing the layer to radiation to cure portions of the layer exposed to the radiation, and removing unexposed portions of the layer by washing with water. In a preferred embodiment, the photocurable material is an organic solvent solution of an epoxy acrylate derived from an epoxy novolac resin which has been carboxylated to render it alkali-developable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.