Method for encapsulation of semiconductor devices with resin and leadframe therefor
US5750423A · kind A · utility
35Cited by
8References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 25, 1995 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Aug 25, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframes is provided with at least one supporting portion extending from an island thereof in the direction opposite to a surface on which a semiconductor chip is mounted, so that the supporting portion comes into contact with a bottom surface of a cavity of a mold for encapsulation of semiconductor chips with a resin when said mold is closed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.