Apparatus and method for dynamically mixing slurry for chemical mechanical polishing
US5750440A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1995 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Nov 20, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01F2101/27
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An apparatus and a method of dynamically mixing a slurry for a chemical mechanical polish includes pumping an abrasive (33) and an oxidizer (37) into a first portion (19) of a slurry mixer (11), using a magnetically coupled stirrer (17) to blend the abrasive (33) and the oxidizer (37) into a slurry (41) in the first portion (19) of the slurry mixer (11), transporting the slurry (41) through a diffuser (21) and into a second portion (22) of the slurry mixer (11), keeping the slurry (41) in the second portion (22) of the slurry mixer (11) for a residence time, and, subsequently, using the slurry (41) to chemical mechanical polish a semiconductor substrate (43). The diffuser (21) reduces air entrainment of the slurry (41), and the residence time enables the slurry (41) to be used when it has a maximum polishing rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.