Thermosetting resin compositions
US5750597A · kind A · utility
9Cited by
6References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 20, 1996 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Jun 20, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L97/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition which can be used to produce pultruded products with a lustrous surface finish comprises about 60% to about 95% by weight of an uncured, liquid phenolic resin containing about 70-90% solids by weight and about 5 to about 40% of particles of a molding composition comprising an uncured, solid phenolic resin and a suitable filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.