Hot-melt adhesives for disposable items and articles made therefrom
US5750623A · kind A · utility
11Cited by
41References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 20, 1996 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | May 20, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F297/04
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Hot-melt adhesive compositions containing high molecular weight linear styrene-isoprene-styrene block copolymers or high molecular weight linear styrene-butadiene-styrene copolymers, having little or no residual diblock, and articles made therefrom. The resulting adhesive composition may include solid tackifying and liquid tackifying resins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.