System and apparatus for reducing arcing and localized heating during microwave processing
US5750968A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1995 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Jun 30, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/102
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system and apparatus for reducing arcing and localized heating as a result of applying microwave energy to a microelectronic substrate having electronic components thereon is provided. A microwave furnace having a chamber is configured to secure a microelectronic substrate therewithin. The microelectronic substrate is electrically interconnected with a ground connected to an interior wall of the microwave furnace. A holder for securing a microelectronic substrate during the application of microwave energy and for providing the necessary electrical connections for grounding components and circuitry thereon is also provided. The holder may have a heat sink for protection against heat build-up and for maintaining a microelectronic substrate in a substantially flat orientation during microwave processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.