Loadlock assembly for an ion implantation system
US5751003A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 1997 |
| Grant date | May 12, 1998 |
| Priority date | — |
| Expiry date | Jan 7, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31705
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a loadlock assembly for a high throughput ion implantation system that rapidly and efficiently processes large quantities of workpieces, such as flat panel displays. The loadlock assembly increases the throughput of the implantation system by continuously cycling workpieces through the process chamber, thus increasing the system's throughput. The loadlock assembly includes a plurality of loadlock stacking elements that are axially positioned relative to each other to form a stacked array of loadlocks. Additionally, the loadlocks of the array are configured to nest with an adjacent loadlock to form a stackable and nestable loadlock assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.