Panel mount structure
US5752854A · kind A · utility
16Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1997 |
| Grant date | May 19, 1998 |
| Priority date | — |
| Expiry date | Feb 18, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/939
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conducting flange (1) for an electrical connector (3) is constructed with, spaced apart points of attachment (14) of the flange (1) to a panel, and multiple bumps (15, 16, 17, 18, 19, 20) on the flange (1) to concentrate pressure between the flange (1) and a panel. The bumps (15, 16, 17, 18, 19, 20) have progressively increased heights as their respective distances increase from a closest of said points of attachment (14) to compensate for corresponding decreases in pressure contact between the flange (1) and the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.