Method for mold clamping units
US5753153A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 2, 1996 |
| Grant date | May 19, 1998 |
| Priority date | — |
| Expiry date | Jan 2, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/6735
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and process for controlling mold activity of a molding machine is disclosed and includes a clamping device for positioning a movable mold platen on a carrier device and relative another platen, for forcefully engaging the movable mold platen with the another platen and on the carrier device, for sustaining forceful engagement of the movable mold platen with the another platen and the carrier device, and for breaking the movable platen from the another platen and the carrying device. The movable mold platen includes a movable mold half and the another platen includes another mold half. The system also includes a manner for determining an adjustable starting position of the clamping device and movable mold platen. A manner for adjusting the adjustable starting position for achieving greater accuracy of the adjustable starting position for the clamping device and the movable platen is provided. The manner for adjusting includes a mechanism for actuating the clamping device. A device for monitoring and controlling the position of the clamping device and movable platen is provided as well as a mechanism for sustaining the clamp-up force at a prescribed level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.