Process for forming deposited film
US5753320A · kind A · utility
39Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1995 |
| Grant date | May 19, 1998 |
| Priority date | — |
| Expiry date | Jun 6, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/482
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for forming a deposited film on a substrate according to the chemical vapor deposition method comprises previously forming excited species of a gas phase compound containing atoms which become constituents constituting said deposited film, supplying the excited species onto the surface of said substrate and effecting photoirradiation on said substrate surface, thereby forming the deposited film through the surface reaction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.