Photocurable and thermosetting matte liquid resist composition
US5753722A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1996 |
| Grant date | May 19, 1998 |
| Priority date | — |
| Expiry date | Dec 10, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photocurable and thermosetting matte liquid resist composition developable with an aqueous alkali solution is disclosed. The composition comprises in combination (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photopolymerization initiator, (C) a diluent, (D) an epoxy compound having at least two epoxy groups in the molecular unit thereof, and further (E) a finely pulverized aluminum silicate matting agent in combination with (F) a filler precipitation preventing agent capable of effective thixotropic adjustment in the composition. The composition may further comprise (G) an epoxy resin curing agent. The composition can be advantageously used for the formation of a solder resist on a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.