Microwave popcorn package with adhesive pattern
US5753895A · kind A · utility
45Cited by
26References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1996 |
| Grant date | May 19, 1998 |
| Priority date | — |
| Expiry date | Jan 16, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S99/14
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A microwave popcorn package is provided. The package generally comprises plies of flexible material, such as paper, bonded or adhered to one another, with a microwave interactive construction therebetween. The laminating adhesive between the plies is applied in a preferred pattern, to advantage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.