Microelectronics package
US5753972A · kind A · utility
16Cited by
26References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 1996 |
| Grant date | May 19, 1998 |
| Priority date | — |
| Expiry date | May 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.