Demountable heat sink
US5754400A · kind A · utility
20Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 1997 |
| Grant date | May 19, 1998 |
| Priority date | — |
| Expiry date | Feb 5, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A demountable, and thus re-usable, conductive heat sink for dissipation of excess heat of an electronic component. The heat sink uses a T-bolt and T-slot for attachment to the electronic component and the printed circuit board, respectively. This attachment eliminates the typical concerns associated with the placement of traces on the PCB to accommodate the holes placed therein for the attachment of conventional heat sinks. The improved designed also facilitates demounting of the heat sink from the printed circuit board and the electronic component without damage thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.