Millimeter-wave wireless interconnection of electronic components
US5754948A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 29, 1995 |
| Grant date | May 19, 1998 |
| Priority date | — |
| Expiry date | Dec 29, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B7/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A millimeter-wave wireless data transmission link is utilized to interconnect multiple electronic components within an enclosed electronic system. More specifically, an electronic apparatus includes a housing, a plurality of separated electronic components located within the housing, and a plurality of millimeter-wave transmit/receive integrated circuit devices, each coupled to a corresponding one of the separated electronic components. Data is transmitted between the plurality of separated electronic components via the millimeter-wave transmit/receive integrated circuit components, each of which includes one or more transmit/receive circuits preferably operating at frequencies above 35 GHz. The transmit and receiving frequencies of the transmit/receive integrated circuit devices can be dynamically set in memory to enable transmission links to be easily reconfigured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.